Packaging of High Power Semiconductor Lasers - Micro- and Opto-Electronic Materials, Structures, and Systems
Packaging of High Power Semiconductor Lasers - Micro- and Opto-Electronic Materials, Structures, and Systems
hardback
Published:
15 July, 2014
hardback
Published:
15 July, 2014
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Description
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
More Details
| Type | Book |
|---|---|
| ISBN13 | 9781461492627 |
| ISBN10 | 1461492629 |
| Number Of Pages | 402 |
| Item Weight | 1000 g |
| Publisher / Reseller | Springer-Verlag New York Inc. |
| Format | hardback |
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Author's Bio
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.